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AT24C02D AT24C02D-XHM-T EEPROM Memory IC 2Kbit I²C 1 MHz 4.5 µs 8-TSSOP
AT24C02D Info：
This IC provides 1024/2048 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 128/256 words of 8 bits each. The device’s cascading feature allows up to eight devices to share a common two‑wire bus. This device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The device is available in space-saving 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP, 5-lead SOT23 and 8-ball VFBGA packages. All packages operate from 1.7V to 3.6V.
| TYPE | DESCRIPTION | |
| 1. | Memory Type | Non-Volatile |
| 2. | Memory Format | EEPROM |
| 3. | Technology | EEPROM |
| 4. | Memory Size | 2k bit |
| 5. | Memory Organization | 256 x 8 |
| 6. | Memory Interface | I²C |
| 7. | Clock Frequency | 1 MHz |
| 8. | Write Cycle Time – Word, Page | 5ms |
| 9. | Access Time | 4.5µs |
| 10. | Voltage – Supply | 1.7V ~ 3.6V |
| 11. | Operating Temperature | ‘-40°C – 85°C (TC) |
| 14. | Supplier Device Package | 8-TSSOP |
| 15. | Base Product Number | AT24C02 |
Features
1. Low-Voltage Operation:
– VCC = 1.7V to 3.6V
2. Internally Organized as 128 x 8 (1K) or 256 x 8 (2K)
3. Industrial Temperature Range: -40°C to +85°C
4. I2C-Compatible (Two-Wire) Serial Interface:
1. 100 kHz Standard mode, 1.7V to 3.6V
2. 400 kHz Fast mode, 1.7V to 3.6V
3. 1 MHz Fast Mode Plus (FM+), 2.5V to 3.6V
5. Schmitt Triggers, Filtered Inputs for Noise Suppression
6. Bidirectional Data Transfer Protocol
7. Write-Protect Pin for Full Array Hardware Data Protection
8. Ultra Low Active Current (1 mA maximum) and Standby Current (0.8μA maximum)
9. 8-Byte Page Write Mode:
– Partial page writes allowed
10. Random and Sequential Read Modes
11. Self-Timed Write Cycle within 5 ms Maximum
12. ESD Protection > 4,000V
13. High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
14. Green Package Options (Lead-free/Halide-free/RoHS compliant)
15. Die Sale Options: Wafer Form and Bumped Wafers
